70 days ago on lem.com

Die Assembly Process Engineer

LEM Holding SA

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Die Assembly Process Engineer

LEM – “At the Heart of Power Electronics”

LEM is the market leader in providing innovative and high quality solutions for measuring electrical parameters.

Its core products - current and voltage transducers - are used in a broad range of applications in drives &

welding, renewable energies & power supplies, traction, high precision, conventional and green cars

businesses. LEM’s strategy is to exploit the intrinsic strengths of its core business, and to develop opportunities

in existing and new markets with new applications. It has production plants in Beijing (China), Geneva

(Switzerland), Sofia (Bulgaria) and Machida (Japan). With regional sales offices near its customers’ locations,

the company is able to offer a seamless service around the globe. LEM has been listed on the SIX Swiss

Exchange since 1986; the company’s ticker symbol is LEHN.

Die Assembly Process Engineer

Based in Geneva – Switzerland

Mission :

Working closely with the ASIC and R&D department, she/he will be responsible for providing the overall die

assembly design. Her/his expertise in wire bond processes will allow her/him to drive the equipment

installation, determine the optimum process parameters and provide support to the production line once in

the make sites.

Main tasks :

 Design die bonding processes, select the best fitting equipment and ensure installation to

meet manufacturing requirements

 Initiate and maintain the specifications including: process FMEA, control plan, production

instructions, failures catalogue…

 Develop and implement training plans to improve staff efficiency and ensure the awareness

of process changes; make sure that employees work daily with zero defect mindset

 Be responsible for yields, quality and cost sustainment and continuous improvement for the

assembly line

 Develops the preventive maintenance procedures and coordinate the schedules of

equipment maintenance

 Manage a continuous improvement team to track and solve abnormal cases

 Deal with non-conformities and corrective actions to eradicate them

 Provide on-call services for shop floor critical application


 Master Degree in Electrical and Electronics Engineering or Equipment equivalent

 Minimum 5 years of semiconductor assembly experience


 In-depth knowledge of glue bonding and wire bonding processes

 Knowledge and experience on MSA, SPC, FMEA, Control plan, 8D is a must

 Professional communication skill in English (written and verbal)

 Drive projects in a multicultural environment

 Outstanding analytical and conceptual competences, high problem solving competency,


 Time management

 Ability to work under pressure

Date of employment: As soon as possible

For further information, please contact: recruit-ch@lem.com

Or visite our website www.lem.com

Unfortunately, we are unable to reply directly to candidates whose files were not retained. We invite you to visit the

job section of our website for other interesting offers.

No employment agencies please.

August 2016 Die Assembly Process Engineer